| 摘要 |
PURPOSE:To thin an apparatus largely by working a lead frame for a built-in IC element as a reinforcing frame in combination and also operating the lead frame as a circuit substrate in combination. CONSTITUTION:A metallic lead frame is expanded in approximately the same size as the size of the external form of an apparatus, and key contacts 1-1, connecting leads 1-2 between a liquid-crystal display element and an IC, an IC bonding region 1-3, connecting terminals 1-4 for chip parts except the IC, connecting terminals 1-5 with electrode terminals for a key sheet, holes 2 for bonding sealing resins on the surface and the back, etc. are arranged properly by using the excess section of the frame. The surface and the back are sealed with a resin 5 with the exception of the key contacts 1-1, the leads 1-2 and the terminals 1-5. Sections 6 are punched, and required circuits are made independent electrically. A solar cell panel 8 is placed on a predetermined position, and the flexible key sheet 9 with terminals and movable contacts for a key where opposite to the terminals 1-5 and a decorative display film 10 are laminated, thus completing a card desk-top calculator. A conventional reinforcing frame is unnecessitated, thus forming an apparatus in extremely thin size. |
