| 摘要 |
PURPOSE:To prevent the generation of trouble in electrical connection due to fatigue of solder for a long time by separating except part of the upper portion of a conductive lead terminal which is fixed on a frame at the upper portion of the terminal from the frame. CONSTITUTION:A lead terminal 15 which is installed side by side inside a frame 11 is fixed on the frame 11 at the upper part of the terminal, separated from the internal surface of the frame 11 by a recessed portion 12 and further separated from the bottom plate 13 of the frame by a through-window 14 which is formed in the bottom 13 and is slightly larger than the external shape of the lower part of the lead terminal 15. Each interval 16a-16d of approx. 0.2-0.3mm. which separates the lead terminal 15 from the frame 11 and the bottom plate 13 is sufficient for a frame of one side approx. 15-30mm.. If installed on a wiring substrate which is made of a material having different thermal expansion rate from that of the frame, the stress caused between the frame of an IC socket and the wiring substrate due to the difference of thermal expansion rate in accordance with a temperature change is absorbed by the deflection indicated by an arrow (m) of the lead terminal 15. |
