| 摘要 |
PURPOSE:To pull up a wafer upward so as not to apply a load to an extremely thin wafer by injecting and jetting water flow from a water injecting port of a concave area drilled on a chuck mechanism body. CONSTITUTION:A concave 2 forming a mechanism for adsorbing a wafer A to be ground is provided on a chuck mechanism body 1 of a grinding machine plurally according to the scale of the chuck mechanism body 1, and a water injecting port 3 for ejecting water flow is formed in the almost the center of the lower face. And ceramics 4 having porosity in porous condition or in vertical direction are rotatably fixed in the concave 2 by making them exposed on the surface of the concave 2 wholly or a little while holding clearance 5 toward the bottom. And in the vicinity of the ceramics, plurality of transfer arm 6 of the wafer A provided with an air adsorbing pad 8 on its tip portion 7 and rotatably moving in the horizontal direction back and forth and liftable are supported with their axes set rotatably side by side. |
