发明名称 METHOD FOR ELECTROLYTICALLY REMOVING COPPER PLATING
摘要 <p>PURPOSE:To enable the use of an electrolytic removing soln. for a long period as well as to carry out efficient electrolytic removal by combining electrolytic removing operation with electrolytic recovering operation so as to prevent the formation of a precipitate in the electrolytic removing soln. CONSTITUTION:An article having copper plating to be removed is put in an electrolytic removing soln. 2, and required electric current is supplied between the article as an anode 3 and a cathode 4 from a power source 7 for electrolytic removal. The copper plating is electrolytically removed from the anode 3 by leaching in the soln. 2. An insoluble anode 5 and a cathode 6 for electrolytic recovery are also put in the soln. 2, and electric current is supplied between them from a power source 8 for electrolytic recovery. Copper ions leached in the soln. 2 from the anode 3 by the electrolytic removing operation are deposited as metallic copper on the anode 6 for electrolytic recovery.</p>
申请公布号 JPS61174400(A) 申请公布日期 1986.08.06
申请号 JP19850012606 申请日期 1985.01.28
申请人 C UYEMURA & CO LTD 发明人 NAKAMURA TAICHI;KITAHATA MOTOYUKI;SHIMOMURA TOMOJI
分类号 C25F5/00;C25C1/12;H05K3/07 主分类号 C25F5/00
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