发明名称 |
METHOD FOR ELECTROLYTICALLY REMOVING COPPER PLATING |
摘要 |
<p>PURPOSE:To enable the use of an electrolytic removing soln. for a long period as well as to carry out efficient electrolytic removal by combining electrolytic removing operation with electrolytic recovering operation so as to prevent the formation of a precipitate in the electrolytic removing soln. CONSTITUTION:An article having copper plating to be removed is put in an electrolytic removing soln. 2, and required electric current is supplied between the article as an anode 3 and a cathode 4 from a power source 7 for electrolytic removal. The copper plating is electrolytically removed from the anode 3 by leaching in the soln. 2. An insoluble anode 5 and a cathode 6 for electrolytic recovery are also put in the soln. 2, and electric current is supplied between them from a power source 8 for electrolytic recovery. Copper ions leached in the soln. 2 from the anode 3 by the electrolytic removing operation are deposited as metallic copper on the anode 6 for electrolytic recovery.</p> |
申请公布号 |
JPS61174400(A) |
申请公布日期 |
1986.08.06 |
申请号 |
JP19850012606 |
申请日期 |
1985.01.28 |
申请人 |
C UYEMURA & CO LTD |
发明人 |
NAKAMURA TAICHI;KITAHATA MOTOYUKI;SHIMOMURA TOMOJI |
分类号 |
C25F5/00;C25C1/12;H05K3/07 |
主分类号 |
C25F5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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