| 摘要 |
PURPOSE:To prevent sticking of splash of resist to the rear side of a wafer by surrounding the outside periphery of a wafer-setting part of a T-head with an annular head having a larger outside dia. than the wafer and adjusting the surface level of both parts on a same level. CONSTITUTION:An annular head 6 having the same inside dia. as wafer and a T-head 7 are provided to a spin coating machine. The outside dia, of the annular head 6 is made same or larger with or than the outside dia. of the wafer, and the surface 8 of the annular head 6 and that 9 of the T-head 7 for placing the wafer are made to be on the same horizontal level. By this constitution, sticking of splashed resist to the rear side of the wafer during spin coating is prevented.
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