发明名称 TRANSFER MOLDING DEVICE
摘要 PURPOSE:To reduce the occurrence of voids in a molded product by causing the tablets made of thermosetting resin to flow into, pushing said tablets with the tip surface of th plunger with a convex shape. CONSTITUTION:The tip surface-shape of a plunger is formed inot a convex shape. When a package 8 is molded by such a transfer moding, the plunger 7a pushed tablets 6. When the tablets 6 become a fluid, the bubbles 11 formed in a gap 10 gather upwardly and reduce the air amount dragged into the molding material flowing into a runner. Accordingly, the voids occurring in a molded product are remarkably reduced, an for instance, the occurrence of inferior products is reduced in the package molding of mold IC.
申请公布号 JPS60143920(A) 申请公布日期 1985.07.30
申请号 JP19830248402 申请日期 1983.12.29
申请人 FUJITSU KK 发明人 SONO RIKUROU;KOBAYASHI KOUICHI;KITASAKO HIROYUKI;KUBOTA AKIHIRO;MURAKI KAZUHIRO
分类号 H01L21/56;B29C45/02;B29C45/53;B29C45/58;B29K101/10;B29L31/34 主分类号 H01L21/56
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