| 摘要 |
<p>IMPROVED HEAT SENSING DEVICE An improved heat sensing tip for a temperature sensing device is provided. The tip comprises an elongated shell of heat conductive material. A temperature probe is positioned for movement within the shell toward and away from an opening in the shell. A cap of heat conductive material is positioned at the front of the probe. A spring urges the cap in contact with the shell for heat conductivity between the two when the device is not in operation. When the device is in operation, the spring bias is overcome thereby providing an insulating air gap between the shell and the tip.</p> |
