发明名称 RESIN-SEALING DEVICE FOR SEMICONDUCTOR ELEMENT
摘要 PURPOSE:To enable to adjust the press pressure with very good precision by a method wherein the titled device is made into such a structure that the driving force of the motor is converted into a thrust force through the ball screw, the nut and so forth, the thrust force is given to the moving platen through the double torque mechanism, and the top force and the bottom force are clamped. CONSTITUTION:The turning force of a motor 16 is transmitted to a ball screw 20 through a power transmission system 17 and a bevel gear pair 18 and 19. When the ball screw 20 is made to revolve, a nut 21 to screw in the ball screw 20, that is, a nut housing 31 is made to ascend. The turning force of the motor 16 is converted into a thrust force in such a way and the thrust force is transmitted to a moving platen 13 through a double torque mechanism 30. The moving platen 13 is made to ascend by such the thrust force and the angle theta of the torque mechanism 30 goes becoming smaller gradually. Finally, a very large force is generated to the upper direction in the diagram near a value that the angle theta becomes 0 from the nature of the torque mechanism 30, and a bottom force 15 and a top force 14 are clamped with a prescribed pressure by this force.
申请公布号 JPS61185945(A) 申请公布日期 1986.08.19
申请号 JP19850026851 申请日期 1985.02.13
申请人 MITSUBISHI ELECTRIC CORP 发明人 TANAKA MINORU;MATSUO ITARU
分类号 H01L21/56;B29C33/22;B29C45/02;B29C45/14;B29C45/64;B29C45/66;B29C45/67;B29K101/10;B29L31/34 主分类号 H01L21/56
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