发明名称 MOLDED RESIN SUBSTRATE
摘要 PURPOSE:To provide a molded resin substrate having excellent dimensional stability and shape stability, composed of polycarbonate resins, and obtained by combining two or more kinds of resins having different molecular weight distribution peaks and having a shrinkage along the flow of the resin different from the shrinkage perpendicular to the flow. CONSTITUTION:(A) A polycarbonate resin composition composed of one or more resins having a weight-average molecular weight (Mw) of 40,000-46,000 (reduced to polystyrene) and two or more molecular weight distribution peaks, and selected from resins having Mw of 40,000<=Mw<43,000 and resins having Mw of 43,000<=Mw<46,000, is optionally compounded with (B) 30wt% glass filler having an aspect ratio of 50-100, and is molded at a resin temperature of 290 deg.C, a mold temperature of 100 deg.C and an injection pressure of 350kg/cm<2> to obtain the objective molded resin article. The obtained article has remarkably excellent dimensional stability and shape stability compared with the conventional article of a resin having single molecular weight peak.
申请公布号 JPS60127356(A) 申请公布日期 1985.07.08
申请号 JP19830235285 申请日期 1983.12.14
申请人 MATSUSHITA DENKI SANGYO KK 发明人 MATSUO TAKAHIRO;NASU KAZUHIKO;KENMOCHI KATSUE
分类号 C08L69/00;H01B3/42 主分类号 C08L69/00
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