发明名称 EPOXY RESIN COMPOSITION
摘要 PURPOSE:To produce an epoxy resin composition having excellent pot-life at low temperature and reactivity at high temperature, and moderate viscosity, by mixing a polybasic carboxylic acid anhydride with a bisphenol compound under melting, and compounding the obtained mixture with an epoxy resin, a catalyst and inorganic powder. CONSTITUTION:The objective composition can be produced by compounding (A) a mixture obtained by mixing (i) 100pts.wt. of a polybasic carboxylic acid anhydride (a curing agent liquid at room temperature or having a melting point of <=150 deg.C, such as methyltetrahydrophthalic anhydride) with (ii) 10-70pts. of a compound having >=2 phenol groups (preferably bisphenol A), with (B) an epoxy resin having >=2 epoxy groups in a molecule, (C) a catalyst (preferably organic acid metal salt, especially zinc octylate) and (D) inorganic powder (preferably alumina powder) as a filler. The amounts of the component A and component C are 30-150pts. and 0.05-5pts. per 100pts. of the component B, respectively, and the amount of the component D is 30-60vol% based on the whole volume of the composition.
申请公布号 JPS60123526(A) 申请公布日期 1985.07.02
申请号 JP19830230936 申请日期 1983.12.06
申请人 MITSUBISHI DENKI KK 发明人 ANDOU TOSHIHARU;DOBASHI MASARU
分类号 C08K3/22;C08G59/00;C08G59/42;C08G59/62;C08G59/68;C08L63/00 主分类号 C08K3/22
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