Method for fabricating superconducting weak-links using electron beam lithography

摘要

A method for fabricating indium variable thickness super conducting microbridges uses a single layer of electron resist and EBL to draw a mask which has a gap with a small amount of undercut. A thin layer of material is deposited at normal incidence to form the bridge and material deposited at a sufficiently large oblique angle forms the banks separately. Typical VTB's have bridges 1000 ANGSTROM thick and <0.4 mu m long with the banks 7 mu m thick and Rn DIFFERENCE 0.1 OMEGA . The method can also form other non-hysteretic weak links such as the SNS junction.