| 摘要 |
A ceramic leadless package for integrated circuits, which comprises a ceramic substrate having first and second opposite surfaces, a plurality of ceramic projections protruding from the first surface, a metallized layer provided on the end surface of each of the projections, an electrode portion for an electronic device provided in the central portion of the second surface, a plurality of metallized layers extending from the circumference of the substrate toward the electrode portion, and a side metallized layer connecting the above metallized portions in the first and second surfaces to each other. In the package of this type, the metallized layers of the first and second surfaces are concave and convex at a position corresponding to each projection, respectively, and a greater part of the metallized layers of the second surface are covered with an insulating layer.
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