发明名称 POLYMER COMPOSITION FOR SEALING ELECTRONIC CIRCUIT ELEMENT
摘要 PURPOSE:The titled composition showing excellent dielectric properties in the high-frequency region and providing easy sealing, comprising a reactive vinyl monomer, 1,2-polybutadiene, a reaction initiator, and amorphous quartz glass powder. CONSTITUTION:100pts.wt. (A) 1,2-polybutadiene is mixed with about 5-30mol%, based on component A, reactive vinyl monomer (e.g., styrene), about 1-2pts.wt. reaction initiator (organic peroxide, e.g., t-butyl perbenzoate), about 200pts.wt. amorphous quartz glass powder and, optionally, about 0.01-1pt.wt. reaction accelerator (e.g., cobalt naphthenate). The moisture resistance can be improved when said glass powder is surface-treated with a silane coupling agent (e.g., gamma-methacryloxypropyl-trimethoxysilane).
申请公布号 JPS60115607(A) 申请公布日期 1985.06.22
申请号 JP19830223651 申请日期 1983.11.28
申请人 MATSUSHITA DENKI SANGYO KK 发明人 SAKURAI WATARU;MORIMOTO TAKAKATSU;SHINODA KENICHI
分类号 C08F2/00;C08F2/44;C08F279/00;C08F279/02;H01B3/44;H01L23/29;H01L23/31 主分类号 C08F2/00
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