发明名称 |
MANUFACTURE OF SEMICONDUCTOR DEVICE |
摘要 |
PURPOSE:To produce a double layered electrode wiring by a method wherein the second Si film with low impurity concentration or no additive at all is deposited on the first Si film with high impurity concentration to substitute a high melting point metal for the second film by means of heat-treatment in the atmosphere of halogenide of high melting point metal. CONSTITUTION:After forming a field oxide film 2, a gate oxide film 3, a P added poly Si film 4 is deposited by means of low pressure CVD process and then a no-additive poly Si film 5 is further deposited to be etched for forming a gate electrode. Next Mo is substrated for a no-additive Si film by means of heat- treatment in the atmosphere of mixed gas of MoF6 and H2. Through these procedures, a double layered gate electrode of P added poly Si film 4 and Mo film 6 with high concentration is completed on the gate oxide film 3 on an Si substrate 1. The electrode in such a constitution is suitable for high speed operation due to excellent interfacial characteristics and lower wiring resistance. |
申请公布号 |
JPS60113928(A) |
申请公布日期 |
1985.06.20 |
申请号 |
JP19830220671 |
申请日期 |
1983.11.25 |
申请人 |
NIPPON DENSHIN DENWA KOSHA |
发明人 |
NAKAYAMA SATOSHI;TOODA HITOSHI;MUROTA JIYUNICHI |
分类号 |
H01L21/28;H01L21/285;H01L29/423;H01L29/43;H01L29/49;H01L29/78;(IPC1-7):H01L21/28 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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