发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To produce a double layered electrode wiring by a method wherein the second Si film with low impurity concentration or no additive at all is deposited on the first Si film with high impurity concentration to substitute a high melting point metal for the second film by means of heat-treatment in the atmosphere of halogenide of high melting point metal. CONSTITUTION:After forming a field oxide film 2, a gate oxide film 3, a P added poly Si film 4 is deposited by means of low pressure CVD process and then a no-additive poly Si film 5 is further deposited to be etched for forming a gate electrode. Next Mo is substrated for a no-additive Si film by means of heat- treatment in the atmosphere of mixed gas of MoF6 and H2. Through these procedures, a double layered gate electrode of P added poly Si film 4 and Mo film 6 with high concentration is completed on the gate oxide film 3 on an Si substrate 1. The electrode in such a constitution is suitable for high speed operation due to excellent interfacial characteristics and lower wiring resistance.
申请公布号 JPS60113928(A) 申请公布日期 1985.06.20
申请号 JP19830220671 申请日期 1983.11.25
申请人 NIPPON DENSHIN DENWA KOSHA 发明人 NAKAYAMA SATOSHI;TOODA HITOSHI;MUROTA JIYUNICHI
分类号 H01L21/28;H01L21/285;H01L29/423;H01L29/43;H01L29/49;H01L29/78;(IPC1-7):H01L21/28 主分类号 H01L21/28
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