| 摘要 |
PURPOSE:To hold a semiconductor substrate firmly without damage by providing a reducing hole and a skirt on the circular end surface of an electrode, keeping the semiconductor substrate in contact with the end surface of the electrode and the skirt and supporting the substrate by decompression. CONSTITUTION:An electrodeposition equipment consists of a container 4 filled with an electrodeposition solution 5 suspended with glass powder, dipped with an electrode 7 and a jig 21 for electrification and support of a semiconductor substrate in the solution 5 and a power source 8 to apply voltage. The jig 21 is an electrode made of a metal and the main body 21a gives the semiconductor substrate adhered to the one end of the jig electrodeposition. That is, the one end surface 21b is a slightly smaller circle than the semiconductor substrate and around it, a skirt 21f made of a flexible material such as silicone rubber and extends toward the end is provided. The skirt is kept in touch with the circumference of the substrate main surface and forms an airtight space with the end surface 21b of the electrode. In the main body 21a, a decompression duct 21c is also provided to hole the semiconductor substrate by decompression. |
