发明名称 EPOXY RESIN COMPOSITION
摘要 PURPOSE:The titled composition useful for sealing parts of electronic circuit, having improved water-vapor resistance, rust prevention, and electrical insulating properties, obtained by adding lanolin, etc. and a specific organic siloxane polymer to an opoxy resin composition containing a curing agent. CONSTITUTION:(A) A epoxy resin is ordinarily blended with (B) a curing agent, (C) lanolin and/or its derivative (lanolin fatty acid, etc.), and (D) an organic siloxane polymer shown by the formula (R<1>-R<10> are alkyl, aryl, alkenyl, aralkyl, H, or OH; n and m are 0 or integer) (e.g., polydimethylsiloxane, etc.), kneaded in a molten state, to give the desired composition. A preferably an amount of the component C is 0.1-10pts.wt. based on 100pts.wt. component A, and an amount of the component D is 0.1-5pts.wt. EFFECT:Penetration of water from the outside and ionic impurities onto the surface of a material to be coated is prevented.
申请公布号 JPS60112814(A) 申请公布日期 1985.06.19
申请号 JP19830221230 申请日期 1983.11.24
申请人 TOYODA CHUO KENKYUSHO KK 发明人 SATOU SHIGEYUKI;MATSUSHITA MITSUMASA
分类号 C08L63/00;C08G59/00;C08G59/40;C08L7/00;C08L21/00;C08L83/04;C08L91/00;H01L23/29;H01L23/31 主分类号 C08L63/00
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