发明名称 FULLY AUTOMATIC SOLDERING DEVICE FOR IC
摘要 PURPOSE:To improve workability and productivity by providing a delivery device on which plural pieces of ICs to be soldered are placed and which delivers intermittently the ICs to conveying rails, etc. and making all the conveying mechanism in soldering automatic. CONSTITUTION:A titled device consists of conveying rails 6 which convey ICs to be soldered, a conveying chain 10, a pickling tank 14 and rinsing tank 15 which clean the ICs, a fluxer 16 and solder tank 18, a rinsing tank 19 which cleans the ICs subjected to soldering and further a delivery device 7, pawls 12 provided to the chain 10 to push and convey the ICs thereon and a housing device 27. The device 7, on which the plural ICs to be soldered are placed, delivers intermittently the ICs to the rails 6. All the conveying mechanisms are automated by the above-mentioned device, by which workability and productivity are improved.
申请公布号 JPS60106663(A) 申请公布日期 1985.06.12
申请号 JP19830212358 申请日期 1983.11.14
申请人 KONDOU KENJI 发明人 KONDOU KENJI
分类号 B23K1/08;B23K3/06;H01L23/50 主分类号 B23K1/08
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