| 摘要 |
PURPOSE:To make uniform the amt. of the solder to be stuck to a solder bump by coating pasty solder in the area larger than the conductor land formed on a printed wiring board and heating the solder thereby forming the solder bump on the conductor land. CONSTITUTION:A conductor layer 2 is formed on a printed wiring board 1 and solder resist 3 is provided thereon except on a conductor land 2a. Pasty solder 4 is coated on the land 2a in a specified amt. by a silk screen printing method to the area larger than the land 2a. The entire part of the board 1 or the neighborhood of the part where the solder 4 is formed is then heated to fix the solder 4, thereby forming the solder bump 4' in the part 2a. The solder bump 4' is thus formed to a uniform height and more highly than in the prior art.
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