| 摘要 |
PURPOSE:To reduce the deformation of leads due to external force applied in a manufacturing process by mechanically fixing sections among the leads in sections separate from a resin seal section simultaneously with a resin in a process through which a semiconductor chip is sealed with the resin. CONSTITUTION:Sections among the leads of lead sections 3 separate from a resin seal section 2 are fixed with a resin 4 at the same time as sealing. The lead sections are detached from a lead frame 1, and the leads are bent and molded. All processes are completed, and the leads are cut again to remove the lead fixing sections 4 by the resin. Accordingly, force applied to every lead can be dispersed and the leads are difficult to be deformed when external force is applied to several lead in the processes, and a semiconductor device, in which the leads are not deformed and which has excellent quality, can be obtained. |
