发明名称 Methods of processing substrates
摘要 A pair of spaced holes (32 and 34) are drilled in a substrate blank (10) diametrically along a line (14) defining a future locating edge (22) of a printed circuit board (12). When the substrate blank (10) is then sheared to form the printed circuit board (12), semi-circular recesses (38 and 40) are formed from the spaced holes (32 and 34) in the resultant board locating edge (22). The printed circuit board (12) then is accurately aligned in a processing station in X- and Y-directions by seating board-locating pins (50 and 52) of special configurations in respective ones of the semi-circular recesses (38 and 40).
申请公布号 US4516318(A) 申请公布日期 1985.05.14
申请号 US19830488856 申请日期 1983.04.26
申请人 AT&T TECHNOLOGIES, INC. 发明人 KIRSCHENMAN, DUANE L.
分类号 H05K13/00;(IPC1-7):H05K3/10 主分类号 H05K13/00
代理机构 代理人
主权项
地址