| 摘要 |
PURPOSE:To enable to mount mixed chip parts with different shape and/or size efficiently by a method wherein multiple dispenser heads interlocking with mounting head is provided thereon to preliminarily coat a substrate with adhesive. CONSTITUTION:When a shifting lever 61 turns forward to shift a dispenser head 4 from the one dot chain lined position to the solid lined position, a push lever 62 turns forward to the two dot chain lined position to push down the dispenser head 4. At this time, when an abutting plate 81 of the dispenser head 4 abuts against a substrate 6, a hoisting rod 79 only is pushed down against the tension of a compression spring 96. Resultantly the upper part of a cylinder 75 is supplied with compressed air from an air hole 84 to push down a push plate 82 coating the substrate 6 with adhesive 73 discharged from an outlet 80. At this time, the amount and shape of coated adhesive may be delicately controlled by means of adjusting air pressure etc. When it is needless to coat the substrate with adhesive, the dispenser heads 4, 5 may be prevented from being pushed down utilizing a height adjusting bolt 71 as a stopper. |
