| 摘要 |
PURPOSE:To obtain a coat protection layer of a uniform thickness by prevention of the outflow of resin by a method wherein, in resin-sealing of semiconductor chips mounted on a abstrate, first a frame is formed by dam-like application of the first resin having a fixed viscosity, so as to surround the chips, and next the inside of the frame is filled with a resin having a lower viscosity. CONSTITUTION:The first and second semiconductor chips 3 and 4 are fixed on the substrate 1 with a required pattern formed, and are connected as required by means of wires 2. Next, the frame 6 is formed by dam-like application of the first resin made of junction coating resin by surrounding the chips and the wires, and the space surrounded by the frame is filled with the second resin 7 having a lower viscosity than the first resin made of the same substance, which resin is then hardened. Such a manner produces a uniform level without the outflow of resin and enables complete envelopment of the chips and the wires. |
