发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent shortcircuit from happening by a method wherein bonding pads arranged on a pellet and lead terminals arranged in the parallel and perpendicular directions with the bonding pads arranged are connected with one another making wire interval wider. CONSTITUTION:Bonding pads 5a-5e are arranged and formed on a pellet 4 almost in parallel with one side of the pellet 4. Lead terminals 6a-6c are arranged lamost in parallel with the bonding pads 5a-5e while terminals 6d and 6e are also arranged in parpendicular direction with the bonding pads 5a-5e. The pads 5a-5c are respectively bonded to the lead terminals 6a-6c while the pads 5d and 5e are respectively bonded to the lead terminals 6e and 6d.
申请公布号 JPS6079733(A) 申请公布日期 1985.05.07
申请号 JP19830186713 申请日期 1983.10.07
申请人 HITACHI SEISAKUSHO KK 发明人 SUZUKI SHIGERU
分类号 H01L21/60 主分类号 H01L21/60
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