| 摘要 |
<p>PURPOSE:To enable to place a package reduced in small size on a printed board in high density by securing a hybrid IC on two ceramic substrates of the same shape, opposing the IC side so as not to contact with the IC, superposing the substrate, connecting to the terminal of the peripheral edge of the substrate through the gap, and then sealing with resin. CONSTITUTION:Two ceramic substrates 9, 12 of the same shape from which a plurality of terminals 10 are projected at the peripheral edge are used, and a plurality of individual parts 91, 92 are secured at the prescribed wide gap on one surface of the substrate 9. When the substrates 9, 12 are also superposed on one surface of the other substrate 12, parts 121, 122 to be introduced into the gap between the parts 91 and 92 are secured, and connecting wirings are connected to the terminal 10 of the terminal group 13 through the gap of the substrates 9, 12. Thereafter, the terminal group 13 are externally exposed, and the substrates 9, 13 are sealed with resin and packaged. Thus, the package can be reduced in size and in cost.</p> |
