| 摘要 |
PURPOSE:To improve the characteristics of heat dissipation remarkably, and to mount parts with high density by dissipating heat generated from an LSI chip through a heat dissipating body fitted to a chip carrier. CONSTITUTION:A heat dissipating body 17 is fitted to an upper section and conductor circuits 12 are fitted to a side surface in a carrier proper 11, and conductor circuits 14 are mounted to a terminal board 13, and connected electrically to said conductor circuits 12 by a cementing material 15, such as solder, adhesives, etc. The heat dissipating body 17 penetrates the carrier proper 11, the conductor circuits 12 are connected to the inside, side surface and lower surface of the carrier proper 11, and have a space, the inside thereof loads an LSI chip 16, and the conductor circuits 14 are connected to both surfaces of the terminal board 13. Leads 19 for the LSI chip 16 are connected to the conductor circuits 12, the conductor circuits 12 are connected to the conductor circuits 14 for the terminal board 13 by the cementing material 15, such as solder, adhesives, etc., the lower surface sections of the conductor circuits 14 are fitted to a printed substrate through soldering, etc. and the carrier is used. A space 20 is buried with a resin or lower melting-point glass in order to protect the LSI chip 16. |
