| 摘要 |
PURPOSE:To obtain the titled device without breakdown due to stress by a method wherein the whole or part of a required circuit on an insulation substrate is coated with latex, which is then rapidly hardened in the surface in the vapor of carboxylic acid, and this elastic film is interposed between a sealing resin. CONSTITUTION:A container 7 is filled with e.g. the vapor 6a of acetic acid 6, and the surface of the latex 5 dripped on the upper surface of a semiconductor chip 4 is rapidly hardened; thereafter the whole of the circuit on the insulation substrate A is sealed with epoxy resin 8. Since the hardened film of latex is rubbery and soft in the entire body, it relaxes the stress applied on the chip 4 by the hardening shrinkage and the heat shrinkage of the resin and thus generates no cutting of Au wires 3 and no cracks of the chip 4. |
