发明名称 |
Protection of semiconductor wire bonding capillary from spark erosion |
摘要 |
A wire bonding capillary of a hard, normally electrically non-conductive material wherein surfaces of the capillary are coated with a thin electrically conductive material for protecting the capillary bonding face from spark erosion damage and reduction in carbon-like material build-up inside the inner taper of the capillary bore by conduction of current from an electronic flame-off (EFO) torch through a low resistance path to ground.
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申请公布号 |
US4513190(A) |
申请公布日期 |
1985.04.23 |
申请号 |
US19830455038 |
申请日期 |
1983.01.03 |
申请人 |
SMALL PRECISION TOOLS, INC. |
发明人 |
ELLETT, KENNETH W.;GLUTZ, PETER |
分类号 |
H01L21/60;B23K20/00;H01L21/603;H01L21/607;(IPC1-7):B23K11/32 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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