| 摘要 |
PURPOSE:To prevent the cracking of a plate by heating a semiconductor element through the irradiation of infrared rays and heating a semiconductor element section in the plate by hot air. CONSTITUTION:The hot air of an inert gas such as N2 gas forwarded into an inner cylinder 12 through a heater 18 from a valve for a hot air feeder 16 is blown against the lower surface of a plate 1 through the holes 12a, 12b of the inner cylinder 12 and the slit 10a of an outer cylinder 10. Infrared rays are irradiated to the upper surfaces of semiconductor elements 2 through the holes 3a of a mask 3 from an infrared irradiator 5. Consequently, the temperature of element 2 sections in the plate 1 also rises because the elements 2 are heated through the projection of infrared rays and the element 2 sections in the plate 1 are heated by hot air. Accordingly, temperature differences among the elements 2 and the plate 1 are reduced, the cracking of the plate 1 is prevented, and the elements are soldered uniformly. |
