发明名称 SOLDERING METHOD OF SEAT PLATE AND LIQUID FLOW PIPE IN HEAT EXCHANGER
摘要 PURPOSE:To solder efficiently and economically seat plates and ends of liquid flow pipes by forming surface layer parts which repel molten solder to the seat plates of a heat exchanger except the peripheral parts of through-holes to be inserted with ends of said liquid flow pipes then immersing the assembly into a solder bath. CONSTITUTION:Seat plates 4 formed of a metal are joined to both ends of a core part 3 consisting of many liquid flow pipes 1 and fins 2 consisting of a metal and a tank 5 is fixed to the plates 4 to assemble a heat exchanger. The ends of the pipes 1 are inserted and tack welded into the through-holes 8 of the seat plates 4 in the stage of assembling said heat exchanger and further a surface treating layer 10 of silicone oil, silicone grease, solder masking material, epoxy resin or the like which repels molten solder is formed thereon except the peripheral parts of the holes 8. The plates 4 and the ends of the pipes 1 are then dipped in a solder bath to stick solder 9 only in the joint parts between the plates 4 and the pipes 1, by which said plates and pipes are joined.
申请公布号 JPS6056470(A) 申请公布日期 1985.04.02
申请号 JP19830163293 申请日期 1983.09.07
申请人 NIPPON RADIATOR KK 发明人 OGASAWARA HITOSHI;YOKOYAMA MASARU
分类号 B23K1/00;B23K1/08;F28F9/18 主分类号 B23K1/00
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