Apparatus for etching metal discs and semiconductor wafers

摘要

The invention is based on an apparatus for etching metal discs and semiconductor wafers embodying an etching device which comprises a spray nozzle arrangement. In order to be able to etch out comparatively deep regions to obtain very largely cylindrical walls with such an etching apparatus, the spray nozzle arrangement (4) comprises pneumatic atomisation nozzles. During the etching process, the discs or wafers (10) are placed at a distance from the spray nozzle arrangement (4) at which the etchant (3) expelled by the pneumatic spray nozzles has been transformed into an etching mist. The invention can be used, in particular, to produce pressure sensors from semiconductor wafers (Figure 1). <IMAGE>