发明名称 WIRE BONDING DEVICE
摘要 PURPOSE:To enable to obtain wire bonding of short time and excellent in junction strength by a method wherein transverse directional micro oscillation different in phase from the micro oscillation on the side of a bonding wire is given to pellets and a work stage. CONSTITUTION:The pellets 2 and a lead frame 3 are mounted on the work stage 1. Next, a CPU12 operates, selects the pad of the pellet 2, and leads the pad to the tip of a bonding tool 4. Then, the tip of the bonding wire 5 is put in contact, and the wire 5 is given the micro oscillation along the X-direction by means of an ultrasonic oscillator 6. On the stage 1, each linear motor 7a and 7b is so driven as to generate micro oscillation, and accordingly micro oscillation is given in the transverse direction of each of X-direction and Y-direction. Thereby, the frictional energy is rapidly increased by relative oscillations of different phases at the contact part between the pellet 2 and the wire 5, and then a large frictional heat can be obtained. Therefore, bonding excellent in junction strength can be performed in a short time.
申请公布号 JPS6050933(A) 申请公布日期 1985.03.22
申请号 JP19830158704 申请日期 1983.08.30
申请人 TOSHIBA KK 发明人 YAMAGUCHI MASAYOSHI
分类号 H01L21/607;H01L21/60 主分类号 H01L21/607
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