| 摘要 |
PURPOSE:To eliminate under- and over-cutting and to perform working with hith accuracy to improve yield by providing inspecting mechanisms which inspect a material to be processed and enabling selection of the optimum conditions for irradiating a laser for the purpose of the working process. CONSTITUTION:A laser processing device consists of inspecting mechanisms 2, 5 which inspect the desired characteristic of a material 1 to be processed, a laser control mechanism 9 which controls a laser processing function according to the information on the result of the inspection emitted from the mechanisms 2, 5 and a laser generating mechanism 4. Said mechanism 4 irradiates laser light 3 controlled by the mechanism 9 to at least a part of the material 1. Under- and over-cutting is eliminated and working with high accuracy is accomplished by the above-mentioned device, by which the yield is improved. |
