| 摘要 |
PURPOSE:To absorb a lead bending section and the thickness of a bent lead in a groove into which the bent lead is buried, and to widen the width of a package only by the absorbing sections by previously forming the groove to the side surface of the package. CONSTITUTION:A semiconductor chip 4 is loaded on a tab as a chip loading section for a lead frame 2, bonding pads for the chip and bonding pads on the lead frame side are connected electrically by connector wires 5, and these lead frame and chip are sealed with a resin, thus forming a sealing body 1. When leads 2 are bent in the upper sections of grooves 3 formed to the sealing body 1, the positions of the bending are positioned on the sides inner than the maximum width X of a package, and the width X of the package can also be made the same as or larger than spaces Y among the leads. |
