发明名称 METHOD AND APPARATUS FOR THERMALLY SOLIDIFYING PLASTIC MOLDING
摘要 <p>PURPOSE:To eliminate deformation caused by the release of a residual distortion generated during the molding of a container in a high temperature sterilization by performing a thermal solidification by heating under a tension. CONSTITUTION:A plug 26b is pressed on a sheet 2 and premolded. Then, the sheet 2 is put tight on the die inner wall 25a and undergoes a vacuum and pressure forming. After the adhesion, the sheet is held tight by compressed air operation for the time enough to release molding distortion depending on the heat of the mold. Then, the pressure in a container is lowered to a level free from possible expansion by the internal pressure even when the mold is opened and shrinkage by the heat shrinking force of the metal container. Then, while the pressure is kept at this level, the mold 25 is moved in the direction of the arrow D2 to open the mold. Then, the container is moved in the directions of the arrows C2 and E2 to be transferred to a cooling stage B and then, cooled down to the temperature free from possible deformation of the container with the removal of the internal pressure from outside with a cooler 22.</p>
申请公布号 JPS6036125(A) 申请公布日期 1985.02.25
申请号 JP19830144617 申请日期 1983.08.08
申请人 MITSUBISHI JUKOGYO KK;TOYO BOSEKI KK 发明人 WAKAMIYA SUKEYOSHI;TAKEUCHI NAOKAZU;HAMA YOSHIHISA;AKASHI TATSU;SHIMURA TATSUO
分类号 B29C51/10;B29C51/30;B29C51/42;B29C71/02;B29K101/00;B29L22/00 主分类号 B29C51/10
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