发明名称 COOLING DEVICE FOR SEMICONDUCTOR ELEMENT
摘要 PURPOSE:To obtain a compact cooling device, assembly thereof is simple, by arranging flat hollow bodies, lower end sections thereof have holes, in parallel, connecting the hollow bodies in a communicating manner through a ring and interposing fins among the hollow bodies in the upper sections of the ring. CONSTITUTION:Long size plates 2, lower ends thereof have holes 2a, fins 7, 8, connecting walls 6, radiator fins 5, rings 4, 10 surrounding the holes 2a, and side plates 9 are set at predetermined positions, and brazed under vacuum simultaneously. Air reservoirs 12 and pipes 15, 16 are welded together. A heat dissipation section A is formed integrally by sections upper than the rings 4 of flat hollow bodies 3 shaped in a communicating manner in parallel and the fins 5 and a tank B by the rings 4 and 10, sections corresponding to the rings of the hollow bodies 3 and the pipes 15, 16. Flon C is encapsulated into the tank B. The generated heat of an element 20 is transmitted over Flon C through fins 21 and Al powdered bodies 24, and boiling Flon is heat dissipated and returns to the tank B. According to the constitution, a device is assembled simply, the expense is also small, and the device can be made compact.
申请公布号 JPS6028254(A) 申请公布日期 1985.02.13
申请号 JP19830137152 申请日期 1983.07.27
申请人 SHIYOUWA ARUMINIUMU KK 发明人 HOSHINO RIYOUICHI;TANAKA HIROKI
分类号 H01L23/427;H01L23/44 主分类号 H01L23/427
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