发明名称 LAPPING METHOD
摘要 PURPOSE:To enable high-precision lapping without generating sags on the edge section by depositing a film on the projection end surface of a work then lap- machining the surface not deposited with the film by the lapping coupled with the projection. CONSTITUTION:When performing finish-machining of a pair of a male mold 3 and a female mold 4, the tip surface of a projection 3b of the male mold 3 is coated with thermosetting resin such as urea resin or epoxy resin, it is heated and heat-cured to form a film 3c, and likewise a film 4c is formed on the end surface of the recess 4b side of the female mold 4. Next, the male mold 3 coated with the film 3c is coupled with the female mold 4, and a lap agent such as diamond with a grain size of about #3000 is inserted between these molds to perform slide lapping. What is actually abraded is the films 3c, 4c, and the profile of the male mold 3 and female mold 4 is not collapsed, thereby lap-machining can be performed on the surface other than the films 3c, 4c while maintaining high profile precision.
申请公布号 JPS6020851(A) 申请公布日期 1985.02.02
申请号 JP19830126132 申请日期 1983.07.13
申请人 TOSHIBA KK 发明人 OOYAMA IWANE
分类号 B24B37/005 主分类号 B24B37/005
代理机构 代理人
主权项
地址