| 摘要 |
PURPOSE:To prevent the generation of a break in a semiconductor element by pushing a joining material on a package, forming an indentation where the semiconductor element is joined and bonding the semiconductor element with the joining material. CONSTITUTION:A force 6 moves to a section just above a joining material 2, and downward moves so that the lower surface of the force 6 reaches to the position of the lower surface of a semiconductor element 3. One part of the joining material 2 is pushed away to the periphery of the force 6 by the force 6, and an indentation 2a is formed to the joining material 2 when the force 6 is moved upward. A collet 4 sucking the semiconductor element 3 moves to a section just above the joining material 2 by sucking air through a vacuum hole 5, and downward moves to push down the semiconductor element 3 into the indentation 2a of the joining material 2, and the semiconductor element is placed on the surface of the indentation 2a. Later, a substrate 1 is cooled, and the joining of the semiconductor element 3 is completed. |
