| 摘要 |
PURPOSE:To increase the removing effect of an internal mold releasing agent in boil-cleaning process also improving the processing capacity by a method wherein a formed resin sealed semiconductor device before boil-cleaning process is heated up to the temperature exceeding the melting point of the internal mold releasing agent. CONSTITUTION:Firstly a resin sealed semiconductor device is heated up to the temperature exceeding the melting point of an internal mold releasing agent contained in sealing resin 2 and then the resin sealed semiconductor device is boil- cleaned in a solution 6 containing an organic solvent for boil-cleaning process. Through these procedures, the removing effect of an internal mold releasing agent 3' displayed by said organic solution 6 may be increased since the resin sealed semiconductor is immersed in the organic solvent 6 boiled at melted condition with even film thickness by means of heating the internal mold releasing agent 3' solidified simultaneously with the completion of forming process up to the temperature exceeding the melting point thereof while the processing capacity may be improved since the temperature rising time of the cleaned item is shortened by preliminary heating process. |
