| 摘要 |
A capacitive acoustic transducer comprises a first field plate mounted to a semiconductor substrate structure, a second metal field plate having first and second oppositely and substantially exposed surfaces, and a mounting arrangement for mounting the second field plate to the semiconductor substrate structure so that the first and second field plates form an acoustically responsive capacitor, the first exposed surface of the second field plate substantially facing the first field plate, the mounting arrangement allowing the second field plate to respond to acoustic energy for altering the capacitance between the first and second field plates, the mounting arrangement including first and second contacts for respective connection to the first and second field plates. The method of fabricating this capacitive acoustic transducer includes the step of forming the second field plate on a disposable support structure, mounting the second field plate on the disposable support structure to the first field plate on the substrate structure and then disposing of the disposable support structure.
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