| 摘要 |
PURPOSE:To offer the title device having a sturdy bonding pad which can endure the mechanical impact at the time of bonding. CONSTITUTION:A metallic film 3' of Al as the first layer is formed on a surface insulation film 2' of a semiconductor substrate 1'. An insulation film 4' is formed thereon and opened at the pad part, and then the metallic film at the pad part is thickened by the formation of a metal 5' such as Al as the second layer and the superposition thereof on the first layer 3'. In this manner, the metallic film thickened in a double-layer functions as a cushion against the impact at the time of compression bonding of wires, etc. and thus buffers the impact on the insulation film 2', therefore the breakdown of the part of the bonding pad is eliminated. |
