SEALING METHOD OF CERAMIC CAP FOR SEMICONDUCTOR ELEMENT PROTECTION

摘要

PURPOSE:To enable to protect a semiconductor element more completely, to shorten the working time to be required for ceramic cap mounting and to control the spewing amount of bonding agent at adhering parts by a method wherein a ceramic cap is conducted to recessed parts provided in a ceramic substrate and a sealing is performed. CONSTITUTION:Recessed parts 5a have been provided in an alumina substrate 5 an epoxy resin 6 has been provided at the recessed parts 5a as a bonding agent. No bonding agent has been used at the connection parts of the ceramic cap 1. The opening end parts of the ceramic cap 1 are inserted in the recessed parts 5a of the alumina substrate 5 and, by heating, pressing and sealing, the sealing for the ceramic cap 1 is completed.