| 摘要 |
<p>A metal plated plastic article (15) for assembly with other components (13, 14) by a dip soldering process. A high temperature/high strength plastic is selected which has a predetermined amount of glass fiber fill to give the plastic article (15) a coefficient of thermal expansion compatible with the articles (13, 14) to which it is to be soldered. The plastic article (15) is metal plated by a method including the steps of surface roughening by abrasion followed by exposure to a particular chemical etch solution followed by chemical plating and electrolytic plating as required. The plating method results in a plated plastic article (15) having a plating peel strength high enough to withstand a soldering process to other articles (13, 14) by means of complete immersion of the articles (13, 14, 15) in a heat medium. The metal plated plastic article (15) is dried, flux is applied to the surfaces to be soldered, solder is applied to the fluxed surfaces, and the assembly of articles (13, 14, 15) is immersed in a heat medium such as hot oil or hot vapor, at a temperature of at least 232oC for a time sufficient to permit solder reflow between the assembled articles (13, 14, 15). </p> |
