| 摘要 |
PURPOSE:To improve the production efficiency of the small quantity production of a large number of sorts by a method wherein semiconductor integrated circuit devices are produced from a wafer on which not less than two types of pellets are arranged. CONSTITUTION:A unit form pellet 6 is composed of, for instance, four types of composition element pellets n1(2), n2(3), n3(4) and n4(5) which have identical outside dimensions and whose inside patterns are different from each other. A wafer 8 is composed by arranging such unit form pellets 6. If the wafer 8 is introduced for production, from (T/N)X4 wafers of one sort, four types of devices can be produced. Compared to the conventional method, the number of wafers to be treated is quadrupled but the number of sorts of wafers is 1/4. With this constitution, the production efficiency of the small quantity production of a large number of sorts can be improved significantly. |
