| 摘要 |
PURPOSE:To prevent the generation of defectives on a resin seal by mounting a detector detecting the state of mold-clamping to a resin-seal die and monitoring the state of mold-clamping. CONSTITUTION:An article to be detected 18 is set up to the side surface of a top force 1 in a resin-seal die of split structure, and a detector 19 such as a proximity switch detecting the article to be detected 18 is mounted to a bottom force 2. The die is clamped under such a state, an output from the detector 19 on an irregular state such as the case when a lead frame 10 for a semiconductor device is bitten and the difference of the plate thickness section is detected is compared while using the sensitivity of the detector 19 under the state of normal mold-clamping as a reference, and the information is outputted to alarming or other apparatus. Damage to the die can be removed completely by controlling a press apparatus so that the force of mold-clamping is reduced only on the detection of the plate thickness section. |
