| 摘要 |
PURPOSE:To improve the resistance to shock, the resistance to humidity and the resistance to heat shock by a method wherein electronic elements coated with a resin for protection are housed in a case consisting of a laminated sheet of a metal sheet and an insulating sheet coated on the surface of the metal sheet. CONSTITUTION:A resin 11 for protection is coated on the inner surface of a case 6 on the surface of an insulating sheet 8b and an IC chip 1, bonding wires 4 and external leads 3, which have been housed in the case 6, in such a way as to cover them. A three-layer laminated sheet for moistureproofing and radiation shielding, which consists of a metal sheet 7a, an insulating sheet 8a and reinforcing sheet 9a, constitutes the case which houses the chip 1, a die pad 2, the leads 3 and the wires 4 in. A three-layer laminated sheet, which consists of a metal sheet 7b, the insulating sheet 8b and a reinforcing sheet 9b, constitutes a sealing sheet 10. |
