PROCESS FOR THE MANUFACTURE OF PRINTED CIRCUITS

摘要

The invention provides a process for the manufacture of printed circuits, comprising first providing an insulating base plate with a pattern of through-holes related to the desired conductive pattern for the later provision of connections to metallic conductive paths to be applied to both sides of the plate, coating the base plate with a light-sensitive photopolymer layer and selectively irradiating and subsequently developing said photopolymer layer to expose zones and through-holes of the base plate again which are provided with a conductive layer to form conductive paths and solder eyes on and connection contacts between the front and rear side of the plate.