发明名称 SOLDER COAT TREATING APPARATUS FOR SEMICONDUCTOR DEVICE AND SOLDERING METHOD
摘要 <p>PURPOSE:To remove effectively remaining flux, by providing carrying rails for a device to be treated, which cause a temperature distribution to vary continuously over a flux treating section, solder dip section, flux removing section, and drying section. CONSTITUTION:A device 1' to be treated is carried by rails 6 to each treating vessel. In this case, since the rails are continuous and thus have a continuous temperature distribution, thermal change of the device 1' to be treated can be buffered. After the device 1' to be treated which was immersed in a flux vessel 7 and then in a solder vessel 8 has had remaining flux immediately washed away by warm water shower 10 or immersion into a warm water vessel, it is washed perfectly in a vessel 12 using warm water, supersonic wave, etc., and is then moved to a fan drying and cooling section. Thus expansion of clearance between leads and resin resulting from thermal shock of the device 1' can be suppressed, and washing effect of the remaining flux can be improved, to enhance reliability of the member 1'.</p>
申请公布号 JPS6239043(A) 申请公布日期 1987.02.20
申请号 JP19850177503 申请日期 1985.08.14
申请人 HITACHI LTD 发明人 MIURA SHINYA;KIYOTA YOSABURO
分类号 H01L23/50;H01L23/48 主分类号 H01L23/50
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