发明名称 |
SOLVENT-RESISTANT HEAT EXPANSIVE MICROCAPSULE |
摘要 |
<p>PURPOSE:To give sufficient solvent resistance and heat expansive property to microcapsule by providing a layer of a thermoplastic polymer softened at higher temp. than the vaporization temp. of a volatile liquid contained in the central part of the microcapsule surrounded by said thermoplastic polymer layer, and a covering layer consisting essentially of gelatin to the outermost surface of the capsule. CONSTITUTION:Volatile liquid 1 (e.g. hexane) is contained in the central part of a capsule; a layer 2 of thermoplastic polymer (e.g. copolymer of vinylidene chloride and acrylonitrile) softened at higher temp. than the vaporizing temp. of the liquid 1 is provided to the outside of said liquid 1; and a covering layer 3 consisting essentially of gelatin is provided to the outermost surface of the microcapsule. Preferred amt. of gelatin for coating the surface of the core capsule is 1-30wt% based on the total dry weight of the double coated microcapsule to be obtd. Further, preferred amt. of the volatile liquid to be contained in the capsule is 3-50wt% based on the weight of the core capsule, more pref. 5- 30wt% for obtg. higher coefft. of thermal expansion. Preferred size of the core capsule is 1-50mu if high coefft. of thermal expansion is desired.</p> |
申请公布号 |
JPS59173132(A) |
申请公布日期 |
1984.10.01 |
申请号 |
JP19830047583 |
申请日期 |
1983.03.22 |
申请人 |
MATSUMOTO YUSHI SEIYAKU KK |
发明人 |
NIINUMA KIKUO;MORIMOTO YOSHIFUMI |
分类号 |
B01J13/02;B01J13/22;C08J9/20;C08K9/08;C08K9/10;C09D5/00;C09D11/00;C09K3/10;H04L12/28;H04L12/54 |
主分类号 |
B01J13/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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