发明名称 MANUFACTURE OF SEMICONDUCTOR MODULE
摘要 PURPOSE:To mount a plurality of electrodes easily by using a frame connecting a plurality of electrodes. CONSTITUTION:A frame 16 is manufactured by connecting electrodes and terminals in a GTO module by tie bars 15, thus accurately positioing the electrodes and the terminals. The electrodes are mounted in such a manner that ceramic substrates 2 are soldered on a Cu base plate 1 and the frame 16 is soldered on the ceramic substrates 2. The tie bars 15 are removed from the frame 16, at least two GTO chips are soldered on the electrodes of the frame 16, and the GTO chips and other electrodes and terminals are connected by aluminum wires, etc. The electrodes and the terminals are mounted by vertically bending them to the Cu base 1.
申请公布号 JPS59172262(A) 申请公布日期 1984.09.28
申请号 JP19830046151 申请日期 1983.03.18
申请人 MITSUBISHI DENKI KK 发明人 NAKAJIMA TOSHIHIRO;YAMAGAMI KOUZOU
分类号 H01L25/07;H01L23/538;H01L25/18;H01L29/74 主分类号 H01L25/07
代理机构 代理人
主权项
地址