发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To improve wetproofing, and to prevent the effects of curing stress and alpha-rays exposure by providing a first base body with a metallic layer and an insulating layer and a second base body, which has a metallic layer and an insulating layer and is fixed to the first base body so that the periphery of an electronic part is hollowed. CONSTITUTION:A first base body 10 consists of a reinforcing layer 1a, in which glass fiber, etc. are impregnated with a synthetic resin such as epoxy resin, and an insulating layer 3a, which is formed on the surface of a metallic foil in aluminum, etc. or a metallic layer 2a such as a metal evaporated film and composed of epoxy resin or a composite material, etc. of epoxy resin and polyester fiber, etc. An electronic part 4 mounted through a die pad 5 has a projecting section 20a at an opposite position so that the periphery is formed in a hollow section 20b. A second base body 20 fixed to the first base body 10 by its own periphery is constituted by a reinforcing layer 1b, a metallic layer 2b formed on the surface of the reinforcing layer 1b and an insulating layer 3b consisting of a composite material, etc. shaped onto the surface of the metallic layer 2b.
申请公布号 JPS59172253(A) 申请公布日期 1984.09.28
申请号 JP19830046153 申请日期 1983.03.18
申请人 MITSUBISHI DENKI KK 发明人 SAKAI KUNIHITO;TAMAOKI AKINOBU;TAKAHAMA TAKASHI
分类号 H01L23/06;H01L21/56;H01L23/02;H01L23/057;H01L23/08;H01L23/14;H01L23/20;H01L23/26;H01L23/29;H01L23/31 主分类号 H01L23/06
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